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x|act µAXI software

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phoenix x|act is a powerful software package for fast and easy CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability.

 

 

 

 

 

 

 

 

 

Features

Unique feature:

  • Highly efficient automated CAD-data import and programming
  • Live 3D overlay of CAD and inspection results even in rotated oblique inspection views at extremely high magnification
  • Optimized positioning accuracy due to 3D auto-referencing

Customer benefits:

  • Extremely high defect coverage and repeatability to assure highest quality requirements
  • Minimum setup time due to easy and fast CAD-data import and programming
  • Time and money saving by using fully automated inspection strategies
  • Once programmed, the inspection program is portable to all x|act compatible phoenix|x-ray systems

Applications

The phoenix x|act software is specially designed for the fully automated X-ray inspection of PCB assemblies with highest defect coverage (µAXI).

Specifications

The phoenix x|act software package includes a correction of CNC and image chain, inspection libraries with different check strategies and the Xe² developer version for check strategy development. x|act comes with an automatic noise reduction system. Different image processing functions optimize inspection results. Furthermore CNC measurement function and macro programming for automated inspection cycles are included.

Required data CAD-data of component and pad position in ASCII format
Modules

 

BGA check strategy automated analysis of BGA solder joints
PTH check strategy automated analysis of PTH solder joints
customized check strategies customization of image processing for automated analysis
bga|module automated analysis of BGA solder joints incl. automated wetting analysis together with ovhm (oblique view at highest magnification)
vc|module automated inspection of IC die attach and area soldering in power electronics
c4|module automated voiding analysis of round solder joints with background structure, such as C4 bumps
ml|module semi automated inspection of IC multi-layer PCBs
qfp|module Xe² module for automated analysis of QFP solder joints
qfn|module Xe² module for automated analysis of QFN solder joints
pth|module< Xe² module for automated analysis of PTH (THT) solder joints
quality|review repair station software for visualizing and manual review of results from an automatic program run, e.g. BGA check strategy or vc|module
converter conversion of result files, generated by x|act, into other formats, required by third party software
Availability Option for phoenix microme|x and phoenix nanome|x systems

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