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phoenix microme|x

Microme|x - X-ray inspection System

The phoenix microme|x is a high-resolution microfocus X-ray inspection system that is mainly designed for real time X-ray inspection of solder joints and electronic components. It combines high-resolution 2D X-ray technology and computed tomography in one system while offering innovative features. The versatile, easy-to-use phoenix microme|x offers outstanding image quality and can be used in failure analysis labs as well as on the production floor. It is equipped with phoenix|x-rays proprietary image processing software for the automated inspection of PCB assemblies offering higher defect coverage while improving production efficiency.

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Features

Key Features

  • High magnification
  • Precise Manipulation
  • High repeatability
  • 180 kV / 20 W high-power microfocus tube with up to 0,5µm detail detectability
  • Optional:
    • x|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
    • Brilliant live images by high dynamic temperature-stabilized GE DXR digital detector with 30 fps (frames per second) and active cooling
    • 3D computed tomography scans within 10 seconds
    • Up to 2 times faster data acquisition at the same high image quality level by diamond|window

Customer Benefits

  • Combined 2D / 3D CT operation
  • Up to 2 times faster data acquisition at the same high image quality level by diamond|window (optionally)
    • Combined 2D/3D CT operation
    • Automation of inspection steps possible
    • Outstanding ease-of-use

Applications

Power Electronics

app-micromex-power-electronics-2

Soldering surface of power semiconductors on ceramic substrate. Through the 3-mm-thick copper heat sink, substrate voids are visible. The solder joints of the semiconductors are free of voids. Even the thin aluminum bond wires are visible. (Learn More)

Mounted Printed Circuit Boards

app-micromex-printed-mounted-circuit-board-2

Microfocus X-ray image of THT solder joints with live CAD overlay. (Learn More)

Semiconductor and Other Electronic Components

app-micromex-semiconductor-2

High-magnification microfocus X-ray image of a copper bond wire with 25 µm diameter. (Learn More)

Accessories

  • CT option: includes software and rotation unit
  • quality|review: Repair station software for visualizing and manual review of results from an automatic program run, e.g. bga|module, qfp|module or vc|module.
  • converter:Software package to convert result files, generated by quality|assurance or x|act, into other formats, required by third party software.
  • quality|analyst: Software package for analyzing and visualizing inspection results, which are collected by an automatic program and reviewed with quality|review.

Specifications

Max. tube voltage 180 kV
Max. output 20 W
Detail detectability Up to 0,5 µm
Min. focus-object-distance 0.3 mm
Max. voxel resolution (depending on object size) < 2 µm
Geometric magnification (2D) up to 1970-fold
Geometric magnification (3D) 100-fold
Max. object size (height x diameter) 680 mm x 635 mm / 27" x 25"
Max. object weight 10 kg/ 22 lbs
Image chain 2 megapixel digital image chain
Manipulation 5-axis sample manipulation
2D X-ray imaging yes
3D computed tomography yes (optional)
System size 1860 mm x 2020 mm x 1920 mm / 73.2” x 79.5” x 75.6”
System weight 2600 kg / 5070 lbs
Radiation Safety - Full protective radiation safety cabinet according to the German RöV (attachment 2 nr. 3) and the US Performance Standard 21 CFR 1020.40 (Cabinet X-ray Systems)
- Radiation leakage rate: < 1.0 µSv/h measured 10 cm from cabinet wall

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Descriptions English Deutsch RU Español
Diamond Window Brochure acrobat-reader
Inspection Technologies Brochure acrobat-reader acrobat-reader acrobat-reader acrobat-reader
microme|x DXR-HD Brochure acrobat-reader acrobat-reader
Package Brochure acrobat-reader
PCBA Brochure acrobat-reader
x-act Brochure acrobat-reader


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