Micro- and nanofocus
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Micro- and nanofocus Overview
High-resolution X-ray inspection has become a widely used tool for non-destructive failure analysis and process control in a variety of industrial and scientific fields, because electronic components are becoming increasingly miniature and even more complex.
Only highest-resolution X-ray technology provides the means necessary to inspect such components. Typical inspection tasks includes:
- Automated solder joint inspection
- Inspection of bond wires and bonding areas
- Void analysis of conductive and non-conductive die bonds
- Analysis of discrete components such as capacitors and inductors
Microfocus and Nanofocus
phoenix nanome|x
Ultra high-resolution nanofocus system designed for inspecting high-quality assemblies and interconnections in the semiconductor and SMT industries.
phoenix microme|x
High-resolution microfocus system designed for real-time X-ray inspection of solder joints and electronic components.
phoenix microme|x DXR-HD
High-resolution 180 kV microfocus system for real-time inspection of solder joints, electronic components and for automated inspection (µAXI).
ndt|analyser
High-resolution microfocus system for real-time 2D X-ray inspection of electronic, mechanic components, sensors, cables, castings etc.
pcba|inspector
High-resolution 2D microfocus X-ray inspection system designed for inspecting solder joints.
phoenix x|act 2D inspection software
For fast and easy CAD based automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability.
phoenix x|argos
High-resolution 2D X-ray inspection system specifically designed for extra large objects up to 100kg (220.46 lb).
phoenix x|aminer
Entry level X-ray inspection system designed for the special needs of the high-resolution inspection of electronic assemblies, components and PCBA
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Application Solutions
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