Ingot/Wafer Orientation
For orientation of single crystal wafers and ingots
XRD 3003 I/W is ultra-precise orientation systems for raw and grinded ingots and wafers. Full automatic XRD 3003 I/W orientation systems can be integrated in and adapted to customer's semiconductor production lines.
Features
- Setup of mechanical ingot rotation axis Automatic ingot X-ray orientation to customer`s specified off-axis angle
- Determination and marking of flat/ notch position Control X-ray measurement of orientation and laser measurement of flat/ notch position for grinded ingot
- Minimization of waste of material by 3D optical laser system
- Special industrial software for system control, analysis, result documentation and data storage integrates all steps in customer's production line.
Applications
- Si, SiC, GaAs, CaF2, SiO2,...
- Orientations: 100, 110, 111, 511,... off-axis orientation <=15°
- Ingot size <= 300 mm (12") diameter, <= 500mm length
- Wafers <= 300 mm (12") diameter