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Sensorics and Electrical Engineering

Solder Joints Inspection

In the inspection of sensors and electronic components, high-resolution X-ray technologies are mostly used to inspect and evaluate contacts, joints, cases, insulators and the situation of assembly. It is even possible to inspect semiconductor components and electronic devices (solder joints) without having to disassemble the device.

 

 

 

 

 

 

 

Gallery

sensorics-crimp-connection

Loose contact of a crimp connection inside a switch: The microfocus X-ray image shows some loose wire strands outside the crimp. The stranded wires inside the crimping zone are only loosely crimped and therefore differentiable. This defect does not adversely affect the compressive strength, since there are enough strands inside the crimp.

sensorics-crimp-connection-2

Microfocus-computed tomography of a crimp connection with a crimp height of 1.4 mm. To determine the number of individual strands and the crimping density, three tomographic layers, of the inlet area, the outlet area and the crimping zone itself (green), are generated: 19 strands enter, but only 17 exit the crimping zone. Due to the lack of material, small voids developed inside the crimping zone.

sensorics-stator-winding

Two broken wires on the stator winding of the electromotor.

sensorics-relay

Oblique view Microfocus X-ray image of four contacts inside a relay. The left contact failed due to overstress.

sensorics-lamda-probe

Microfocus-computed tomographic image of a lamda probe (connector-side view) showing the Inconell-protective case (yellow), including laser welded seams, crimp connections (blue) and contacts of the ceramic oxygen sensor (blue/red).

Products

nanotomndt|analyserpcba|inspectorv|tome|x s
link-nanotom-ct-system link-ndt-analyser-x-ray-system link-pcba-inspector-inspection-system link-vtomex-s-industrial-ct-system
Max. resolution (depending on object size) <0,5µ (3D) <1µ (2D) 2µ (3D) 4µ (3D)
Max. object size (height x diameter) 6" x 5" appr. 16" x 12" 16" x 4" app. 12" x 10"
2D X-ray imaging no yes yes yes
3D computed tomography yes yes (optional) no yes
Advanced surface extraction yes (optional) yes (optional) no yes (optional)
CAD comparison + dimensional measurement yes (optional) yes (optional) no yes (optional)
Max. tube voltage 180kV 240kV 130kV 240kV