Semiconductor and Other Electronic Components

Electronic components are becoming increasingly miniaturized. Only high-resolution and magnification X-ray technology provides the means necessary to inspect such components. Typical inspection tasks includes:

• Inspection of bond wires and bonding areas
• Void analysis of conductive and non-conductive die bonds
• Inspection of flip-chip solder joints in processor cases
• Analysis of discrete components such as capacitors and inductors

Gallery

	nanofocus X-ray image of a broken bond wire inside an IC- case.
	Die attach voids on the backside of a semiconductor inside an IC-case. Void size and distribution are determined fully automatically.
	High- magnification nanofocus X-ray image of a ball bond inside a light-emitting diode. The gold wire is 25 µm wide.
	nanofocus X-ray image of flip- chip solder joints inside a processor case. The image shows one solder bridge and several open solder joints. The solder joint diameter is app. 150 µm.
	nanoCT® of a SMD-inductor, size 0805 (2.0 mm x 1.2 mm). The 3D X-ray image shows the interior coil behind the end cap. In any conventional radiograph, the layers would be overlapping, but the nanoCT® succeeds in displaying the object layer by layer.

Products

	microme|x	nanome|x	pcba|inspector
3D Computed Tomography	yes (optional)	yes (optional)	no
Maximum Inspection Area	24” x 22”	24” x 22”	24“ x 18“
Real-time Detector Resolution	2 MPixel and 24" monitor	2 MPixel (optional 4 MPixel) and 24" monitor	848 x 480 Pixel
Detail Detectability	<1µ	<0,3µ (300nm)	<2µ
Maximum Magnification	up to 23.320x	up to 25.000x	up to 460x
Automated X-ray Inspection	BGA, CSP, QFP, QFN, PTH, Voiding Calculation, Wire Sweep	BGA, CSP, QFP, QFN, PTH, Voiding Calulation, Wire Sweep	BGA, Voiding Calculation
Maximum Tube Voltage	180kV	180kV	130kV