x|act offers live overlay of CAD-data in the live X-ray image. Information about the solder joint, e.g. pad numbering, related package or inspection results is available at any time.

Visible in the X-ray image is missing heel fillet and complete missing solder at two gullwing solder joints. Cause of error: Poor solder paste pressure.

Microfocus X-ray image of BGA solder joints in vertical top-down view:

Four solder joints are connected by solder bridges. The solder penetrated a through-hole plating. Cause of error: Defective masking laquer.

Microfocus X-ray image of BGA solder joints in oblique view at a detector angle of 55°:

Two open solder joints are present; the soldering paste melted and wetted the pads, but did not form a junction with the solder balls. Cause of error: poor solder surface, oxide film.

nanoCT® of two neighboured BGA solder joints. The solder joint at the left is open: The soldering paste melted and wetted the pads, but did not form a junction with the solder balls. The lighter areas are different metallic phases.

nanoCT® of a µBGA after 4000 temperature stress cycles. Due to a voxelsize of 0.5 microns, cracks with 8 to < 1 micron are detectable.

Microfocus X-ray image QFN solder joints in oblique view at a detector angle of 45°:

Two landings of two solder joints are not wetted. Cause of error: Poor solder paste pressure.

Microfocus X-ray image of through-hole solder joints in oblique view at a detector angle of 50 °: The through-hole plating in the center is not properly soldered. The solder has wetted the pin, but not the plating wall. Cause of error: Poor wall metallization.