Multi-layer Circuit Boards
In multilayer circuit board manufacturing, high-resolution X-ray technology is mainly used to determine the layer offset and minimum annular width. Oblique view X-ray images, by providing layer-by-layer visualization, allow detecting flaws and defects such as short circuits caused by etching or layout defects, defective conductor tracks and flawed via metallization.
Gallery
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Measurement of layer offset and annular ring width using phoenix|x-rays’s image processing software "quality|assurance”. |
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Through-hole platings in oblique view at a detector angle of 50°. The connections of all 8 layers are clearly differentiable. |
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Short circuit between two conductor tracks, located in the same spot, due to an etching defect. |
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Defective plating of a through-hole in oblique view at a detector angle of 50°. |
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Laser-drilled micro-via: Analysing wall thickness and drilling quality. Drilling diameter 150 µm. |